Arlington, Va. – More than 700 student teams representing 48 states, the District of Columbia and the U.S. Virgin Islands are preparing for the 2014 Team America Rocketry Challenge, the world’s largest student rocket contest and a key piece of the aerospace and defense industry’s strategy to build a stronger U.S. workforce in science, technology, engineering and math (STEM).
Last year, AIA partnered with IHS and CADENAS PARTsolutions to create authorized 3D computer-aided design (CAD) models of components based on critical National Aerospace Standards (NAS). The result was a valuable new tool for engineers across the aerospace industry to accelerate innovation, shorten design cycles and reduce costs. 3D models are now available for the most used NAS/NASM/NA/NAM parts. The catalog was made available through IHS and PARTsolutions last month.
On February 3, AIA submitted a comment letter to the Federal Acquisition Regulatory Secretariat of the U.S. General Services Administration on behalf of its member companies in response to FAR CASE 2012—032, a proposed rule regarding “Higher-Level Contract Quality Requirements” to support initiatives pertaining to the proliferation of counterfeit parts.
Last November, Defense Federal Acquisition Regulation Supplement (DFARS) case 2011-D039 was published as a rule for safeguarding unclassified technical information. This rule amends the original DFARS by adding requirements for the safeguarding of unclassified information within contractor information systems. The purpose of this DFARS rule is to ensure contractors and their suppliers are implementing adequate security measures and safeguards for DOD unclassified technical information on a contractor’s information systems.
The European environmental directives for Restrictions of Hazardous Substances (RoHS), which includes restrictions on the use of lead in electronics, has affected the global supply chain for materials used in aerospace products. The result of this market shift is important for AIA member companies, forcing a transition away from tin-lead (SnPb) alloys used in the assembly and coating for high performance electronics.