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The Lead(Pb)-free Electronics Risk Management (PERM) Consortium addresses issues pertaining to the world conversion from lead (Pb) containing solder and components to Pb-free constructions. Aerospace, Defense and High Performance (ADHP) electronics make up a very small part (less than 1 percent) of the total world electronics production. Understanding the performance and reliability of Pb-free components/solders presents designers with a challenge to match the long product life expected in the aerospace and defense sectors.
At the last PERM meeting held at the Naval Surface Warfare Center (NSWC) in Crane, Ind., the NSWC reported they are establishing Pb-free control plans locally, and are making efforts to expand plan implementation to the Navy and the Defense Department as well. NSWC has been designated as the DOD Executive Agent for Printed Circuit Board Technology and is also the leader within the defense industry for circuit board soldering standards.
The PERM meeting at NSWC included the following agenda items:
Additionally, PERM is active in promoting Pb-free control plans and standards globally. PERM-generated TechAmerica (GEIA) standards are now being adopted by NATO and are inputs to the International Electrotechnical Commission (IEC) Technical Committee 107, “PROCESS MANAGEMENT FOR AVIONICS.”
AIA Contact: rusty.rentsch[at]aia-aerospace.org